发明名称 |
PROCESS FOR APPLYING A PHOTORESIST, AND PHOTORESIST SOLUTION |
摘要 |
<p>This invention is directed to processes for using a light sensitive photoresist material in the manufacture of an article having a surface permanently modified in an image pattern. The process comprises applying the photoresist to a substrate through a screen, preferably as a continuous, incompletely imaged layer and thereafter, imaging and developing to provide a relief image in the photoresist layer and treating the substrate to provide a permanent image in the finished article. The process is particularly useful in the manufacture of printed circuits. The process is believed to be a departure from conventional processes in the step of screening a light sensitive photoresist material over a substrate.</p> |
申请公布号 |
EP0027603(B1) |
申请公布日期 |
1984.05.23 |
申请号 |
EP19800106133 |
申请日期 |
1980.10.09 |
申请人 |
SHIPLEY COMPANY INC. |
发明人 |
ODDI, MICHAEL J.;ORIO, ALFRED P. |
分类号 |
G03C1/74;G03F7/16;H01L21/027;H05K3/06;H05K3/10;H05K3/12;H05K3/28;(IPC1-7):05K3/06 |
主分类号 |
G03C1/74 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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