| 摘要 |
PURPOSE:To mount a part of externally provided parts by a method wherein the prescribed circuit pattern is formed by a lead frame. CONSTITUTION:An integrated circuit element 22 is die-bonded and wire-bonded by a gold wire 23 on a lead frame 21 formed with a circuit pattern, which is attachable externally provided parts, according to an etching, etc. On the frame 21, a chip type electronic parts 24 and a small-sized electronic parts 25 are simultaneously mounted as a part among the necessary externally provided parts. These are simultaneously packaged with a sealing resin, from which a terminal for attaching lead wires is salient. On the terminal, a parts 27 with lead is mounted. |
