| 摘要 |
PURPOSE:To contrive to disperse the internal strain of a resin and thus prevent the generation of cracks by a method wherein a plurality of cutouts of arc or wave form are provided at the side surface in the periphery of a bed for mounting a semiconductor pellet of a lead frame. CONSTITUTION:The bed 2 of the frame for mounting the semiconductor pellet 1 is punched, thus providing the semi-circular cutouts 10 of the depth of 0.5mm. in the periphery thereof, and the pellet 1 are installed on the bed 2. The cutouts 10 cause to disperse the strain to the bed periphery due to the difference of coefficients of thermal expansion and thermal conductivities between the package resin and the bed, and to block the generation of cracks; therefore the yield and the reliability largely improve. |
