发明名称 |
Semi-conductor power device assembly and method of manufacture thereof |
摘要 |
A heat spreader has a thin ceramic layer plasma sprayed onto its lower surface which may be chamfered. The upper surface of the spreader is then plated with a thin nickel or gold layer and a semi-conductor power device is soldered to the latter. The spreader is then secured via the ceramic layer to a base material serving as a heat sink by a layer of epoxy resin loaded with silver particles. The thin ceramic layer electrically insulates the spreader from the base material but enables heat conduction therebetween. The application of the plasma sprayed ceramic layer to the spreader is easy and economical to effect.
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申请公布号 |
US4450471(A) |
申请公布日期 |
1984.05.22 |
申请号 |
US19810272960 |
申请日期 |
1981.06.12 |
申请人 |
LUCAS INDUSTRIES LIMITED |
发明人 |
WELLHOEEFER, FELICITAS;STACEY, DECEASED, DAVID W.;STACEY, LEGAL REPRESENTATIVE, BY LESLEY A. |
分类号 |
H01L23/34;H01L21/48;H01L23/36;H01L23/373;(IPC1-7):H01L23/14 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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