| 摘要 |
PURPOSE:To obtain multifunctional effects, such as the prevention of cracks, wetproofing, the prevention of noises, the prevention of alpha-rays, etc. by pasting a resin film with a metallic layer on a semiconductor chip. CONSTITUTION:The resin sheet with the metallic layer in which the metallic layer 2 made of laminated or evaporated aluminum, etc. is formed on the surface of a heat-resisting resin film 1 is heated, pressure-bonded and pasted on the whole surface of a central section except peripheral bonding pad sections 5 in an IC chip 4. The IC chip 4 with the sheet is further enclosed in a package made of epoxy, etc., but the resin sheet 1 functions as a stress buffer material at that time. The metallic layer 2 prevents the intrusion of high-frequency noises or alpha-rays to the chip 4. When silicon group adhesives 3 are pasted on the whole surface of the resin sheet with the metallic layer, the wetproofing of the IC chip 4 is improved by the repellency of silicon. |
