| 摘要 |
Solder stripping solution having an extended life for stripping and removing tin-lead alloy solder or tin deposits from entire circuits or tabs with an insignificant amount of attack on the base epoxy laminate or underlay copper or nickel substrate while leaving a residue-free substrate surface. This solution can be utilized at room temperature or preferably slightly above, and has a prolonged useful life of weeks to months. The composition of the solution includes a hydroxyphenol in an aqueous solution of a nitro-substituted aromatic compound, an inorganic acid, and thiourea. |
