发明名称 MANUFACTURE OF SOLID STATE IMAGE PICKUP DEVICE
摘要 PURPOSE:To enable to stably and inexpensively perform an airtight seal of high quality by sealing between a metal layer formed at the hole end of a ceramic substrate and a glass cap through a metal solder. CONSTITUTION:Metal base which is formed, for example, Ag, Au, Ag-Pd, Ag-Pt, Au-Pd or Au-Pt is coated on the sealing surface of a ceramic substrate 1 and baked to form a metal layer 13 having airtightness. A glass cap 11 is placed through a metal solder 14, heated to press-bond between the cap 11 and the substrate 1, and the solder 14 is crushed and bonded. When the solder 14 employs the material which has a melting point of approx. 240 deg.C or lower, the thermal loss of a gelatine filter is suppressed to stabilize the quality.
申请公布号 JPS5986256(A) 申请公布日期 1984.05.18
申请号 JP19820196013 申请日期 1982.11.10
申请人 HITACHI SEISAKUSHO KK 发明人 KAWAMURA HIROMITSU;EZAWA MASAYOSHI;MISUMI AKIRA;OBARA KATSUMI
分类号 H01L27/14;H01L31/02;H01L31/0203 主分类号 H01L27/14
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