| 摘要 |
PURPOSE:To prevent the production of voids and the deformation of a bonding wire by openably providing a shield in a gate which communicates with a cavity, and equalizing the filling velocity and the curing velocity of the resin flowed into the cavity. CONSTITUTION:Gates 12 are brancbed at the prescribed interval in a runner 11 of a resin supplying passage which is introduced from a cull 10 in which resin of melted state is accumulated. The end of the gate 12 communicates with a cavity 13 for containing a material to be molded. Shield plates 14 which shields the passages to the cavities 13 is openably provided in the gates 12. In this semiconductor resin sealing mold 20, the gates 12 are shielded in advance by the plates 14, melted resin is introduced from the cull 10 through the runner 11 to the respective gates 12, and the shields 14 are opened so that the resin is sequentially supplied from the cavities 13 isolated at the farthest from the cull 10. In this manner, the filling velocity and the curing velocity of the resin flowed into all the cavities 13 are equalized. |
