| 摘要 |
PURPOSE:To eliminate the disconnection of wirings due to an improper electric shortcircuit occurred owing to long wirings at wire bonding time and to an erroneous correction of hung wirings by forming an insulator on the outer periphery of a semiconductor element placing portion. CONSTITUTION:An insulator 4 is provided on the outer periphery of an element placing portion 6. Thus, even if bonded gold wirings 5 are contacted with the portion 6, the wirings 5 and the portion 6 are not electrically conducted. Accordingly, a semiconductor device which has good quality can be supplied even if it is not corrected. |
