| 摘要 |
A memory board stacking module comprises a mother board (10) having female input/output sockets (12) in electrical connection with mother board circuitry. A first memory board (20) carrying memory chips (22) is connected by an input/output conductor scheme to a first row (28) of input/output stacking contacts (32a) each of the stacking contacts having a female socket end (34a) supported in the first memory board and a male end (36a) opposite thereto, each male end being removably received in one of the female sockets (12) of the mother board. A second memory board (40) carrying memory chips (22) is connected by an input/output conductor scheme to a first row (48) of input/output stacking contacts (32b), each of the stacking contacts having a female socket end (34b) supported in the second memory board and a male end (36b) opposite thereto, each of the male ends (36b) of the stacking contacts of the said second memory board (40) being removably received in one of the female socket ends (34a) of the stacking contact of the first memory board (20). The stacking contacts electrically connect the memory chips of the first memory board and the memory chips of the second memory board with the mother board circuitry. <IMAGE> |
