| 发明名称 |
ETCHING CAVATIES AND APERTURES IN SUBSTRATES |
| 摘要 |
Deep cavities and apertures can be obtained with little undercutting (great etching factor) by etching in an artificial gravitational field (under the influence of centrifugal or centripetal forces). |
| 申请公布号 |
AU2097983(A) |
申请公布日期 |
1984.05.17 |
| 申请号 |
AU19830020979 |
申请日期 |
1983.11.04 |
| 申请人 |
PHILIPS: GLOEILAMPENFABRIEKEN N.V. |
发明人 |
HENDRIK KLAAS KIUKEN;RUDOLF PAULUS TIJBURG |
| 分类号 |
H01L21/306;C23F1/00;C23F1/02 |
主分类号 |
H01L21/306 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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