| 摘要 |
<p>A method of selective plating a component (1), which method comprises contacting a lower face of the component (1) with a contoured lower mask (17) having a plating aperture so as to expose an area of the component (1) to be plated, positioning the component (1) over a plating tank and selective plating the component (1) with a plating medium (19), wherein the cross-sectional area of the plating aperture is enlarged at the surface of the component (1) so as to define one or more cavities (18) in which the plating rate is lower than elsewhere in the plating aperture.</p> |
