Multi-plate capacitors and methods of making them.

摘要

A laminated capacitor 38 is joined to the surface of a chip carrier 10 for large scale integrated circuit chips. The capacitor includes a mutliplicity of parallel capacitor plates 30 separated by insulating layers 41. The capacitor is bonded to the chip carrier by an array of solder bars 20 to 28 comprising elongated strips of metallic material which register with and adhere to car contacts 11 to 19 on the carrier. Each of the bars is connected to a set of the capacitor plates in the laminated capacitor by means of tab connections 31 to 35 on the plates, whereby each of the plates is connected by a plurality of tabs to a plurality of the solder bars. The intervening capacitor plates (not shown) are similarly joined by tabs to the intervening bars 21, 23, 25, 27. Methods of fabrication of the laminated capacitor structure and solder bars are described.