| 摘要 |
<p>PURPOSE:To enable the improvement of the manufacturing efficiency due to the reduction of the number of manufacturing processes and enable the reduction of manufacturing facilities by soldering mounted components and external leads to electrode patterns before sizing an insulation substrate. CONSTITUTION:The electrode patterns including electrodes 3 for attaching the external leads, resistor patterns, etc. are formed on the insulation substrate 1. Next, paste form solder is printed on fixed parts of the electrode patterns of the substrate and on the electrodes 3. Then, the mounting components 4 and the external leads 5 are mounted at the printed parts of the paste solder. In this case, the leads 5 are mounted at both ends of the substrate 1. And, the components 4 and the leads 5 are soldered on the substrate 1 by solder reflow. The leads 5 are cut along dot lines a-b and c-d, and the substrate 1 are divided along slits 2, thus obtaining the four thick hybrid integrated circuits. This method enables to solder the components 4 and the leads 5 at the same time, and to immediately print the solder paste after print-forming the electrode patterns and the resistor patterns on the substrate 1.</p> |
