| 摘要 |
PURPOSE:To set up a large number of pads for a power supply in a gate array, and to increase the degree of freedom of wire bonding on the mounting of a chip by utilizing unnecessary pads as the power-supply pads. CONSTITUTION:An input pad 201 and the input terminal 202 of an input circuit 203 are connected to an internal circuit 204, and the terminal is lined with a ground or brought to a power-supply potential. An input pad 301 is lined with the ground or brought to the power-supply potential to an internal circuit 304, and the input terminal 302 of an input circuit 303 is connected to a power supply line at potential reverse to the input pad 301. Accordingly, the pads 201, 301 unnecessary in a circuit shape are utilized as the power-supply pads. |
