| 摘要 |
PURPOSE:To eliminate the need for the molding of external leads, to facilitate manufacture and to improve the reliability of mounting in a low-cost printed circuit substrate by forming recessed sections to the circumferential surface of a package proper while being opposed to each external lead and exposing the external leads into the recessed sections. CONSTITUTION:A lead frame 10 has a tab 11 formed at the center, internal leads 12 arranged around the tab and the external leads 13 unified with the internal leads. A semiconductor element pellet 14 is fixed onto the tab 11, and the internal leads 12 and wires 15 are connected. The semicircular groove-shaped recessed sections 17 extending in the vertical direction are each formed at the relative positions of the external leads 13 of the circumferential surface of the package proper 16, and one parts of the noses of the external leads 13 are exposed from the recessed sections 17. Accordingly, the external leads 13 need not be folded and molded completely, the whole processes are reduced largely, and manufacturing work can be facilitated remarkably. |
