| 摘要 |
PURPOSE:To shorten wire-bonding time largely by providing a position recognizer and a position recognizing confirmer, compensating a positional recognizing data on the basis of the transfer excess-deficiency detecting data of a tray and bonding a wire. CONSTITUTION:A scanning eye 18 for the position recognizer 16 each recognizes the coordinates of the bonding pads of each semiconductor chip 2 on the trays 12 and the coordinates of positions to be bonded of each external mood 3, and makes the coordinates contain in a register as position recognizing informations in succession. A turntable 11 is turned, and the semiconductor chips 2 on the trays 12 are transferred to an arrest point in a third work partition (c). When the reference position of a movement does not stop at a prearranged movement position and is displaced and an error is detected by the position recognizing confirmer 22, a position compensation information is added to a bonding mutual position recognizing information consisting of a plurality of X coordinate signals and Y coordinate signals recognized in a second work partition (b) and transmitted over a bonding device 19 as a bonding positional information, and wire bonding being required is executed. |
