发明名称 REMOVING DEVICE FOR UNNECESSARY RESIN OF RESIN SEAL SEMICONDUCTOR DEVICE
摘要 PURPOSE:To remove the unnecessary resin section mechanically, and to improve productivity by holding a lead frame between a lower holder and an upper stripper plate while relatively dropping a cutting tool fitted to an upper supporter supporting the stripper plate. CONSTITUTION:The lead frame 1 is carried between receivers 11 and the stripper plate 13 by a conveyor, and positioned in the predetermined horizontal direction. The lower supporter 10 is elevated up to a prescribed position by a drive, the lead frame 1 is received on the receivers 11, and the lower side of a resin seal body 3 and the unnecessary resin section 4 are brought to the state in which they are made escape. The upper supporter 12 begins to fall by the drive, and the stripper plate 13 is in contact with the upper section of the lead frame 1 and the lead frame is held between the plate 13 and the receivers 11. The upper supporter 12 is further dropped, the spring pressure of a compression spring 15 increases and push force to the lead frame 1 increases while the projecting unnecessary resin section 4 is pushed down by the cutting tool 16, and the unnecessary resin section 4 is detached from the lead frame 1 and each resin seal body 3 at the bottom dead center of the upper supporter 12, thus completing a removal.
申请公布号 JPS5982733(A) 申请公布日期 1984.05.12
申请号 JP19820193793 申请日期 1982.11.02
申请人 MITSUBISHI DENKI KK 发明人 AOKI HIDEJI;YOSHIOKA JIYUNICHI
分类号 H01L23/48;H01L21/56 主分类号 H01L23/48
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