| 摘要 |
PURPOSE:To enable to prevent a semiconductor element base plate to be adhered and fixed to a package from a potential variation by a method wherein a capacitor having a function as a smoothing capacitor is formed by the package itself for the semiconductor device. CONSTITUTION:The conductive mounting part 2 of a package is made as the electrode on one side of a capacitor, a conductive layer 8 is made as another side electrode, and moreover, a dielectric layer 9 having a dielectric constant higher than the package base body 1 is provided between the electrodes thereof to form therewith the capacitor. A memory chip 5 is adhered to be fixed to the mounting part 2, and moreover, connection between electrodes on the memory chip 5 and outside terminals 3, 4 according to metal fine wires 6 is performed, and after then, the opening part of the package is sealed by a cover plate 7 to complete airtight sealing. The capacity value of the capacitor is decided according to the dielectric constant, the area and thickness of the dielectric layer 9. Accordingly, the capacitor is connected between the mounting part 2 and the zero potential electric power source terminal 3 to function as a smoothing capacitor, and the base plate is prevented from a potential variation. |
