| 摘要 |
PURPOSE:To obtain the titled electroless plating bath having improved stability and increased utilization rates of Pt and Pd by adding Pt, or Pt together with Pd in the form of nitro or nitroammine complex salts and a hydroxylamine salt as a stabilizer and by specifying the pH. CONSTITUTION:This electroless plating bath for plating Pt or a Pt-Pd alloy has 10-13 pH and contains a nitro or nitroammine complex salt of Pt or the complex salt and a nitro or nitroammine complex salt of Pd (a), a hydroxylamine salt (b) as a stabilizer, and hydrazine (c). By the bath composition the stability of the soln. is improved, and deposition is carried out with increased selectivity. The plating bath is applicable to electronic parts made of Cu, Ni, Fe or an alloy thereof, an electrode material, plastic products, glass, etc. |
