| 摘要 |
PURPOSE:To obtain a method through which the wafer and a mask are fast stuck and separated by projecting the central section of the wafer, slowly introducing a gas between the wafer and the mask from the periphery of the wafer and separating the wafer and the mask. CONSTITUTION:When the mask 22 is positioned at a predetermined position on the wafer 21, the blow-off of air and the suction of air are stopped and the projecting deformation of the wafer 21 is released, the wafer 21 and the mask 22 shift to a closely adhesive state to the peripheral section from the central section. A pattern of the mask 22 is baked and exposed to the wafer 21, air is blown off from air blow-off ports 12 and air is sucked from air suction ports 13 again, and the wafer 21 is warped and deformed, thus separating the mask. The mask 22 can be separated easily from the wafer 21 because air can intrude freely between the wafer 21 and the mask 22 from the peripheral direction at that time. |
