| 摘要 |
PURPOSE:To obtain an electroless Ru plating bath having improved stability, an increased utilization rate of Ru and a dropped operation temp. by blending a nitrosylammine complex salt of Ru with hydrazine and by adjusting the pH. CONSTITUTION:Hydrazine is added to a nitrosylammine complex salt of Ru, and the pH is adjusted to 10'13 with an aqueous ammonia soln. or the like to obtain a stable electroless plating bath. A hydroxylamine salt may be added to the bath to improve the stability. The plating bath is used at room temp. - about 60 deg.C. Plating in the plating bath proceeds well until Ru in the soln. is consumed at >=about 90% high rate. The plating bath is applicable to electronic parts made of Cu, Ni, Fe or an alloy thereof, an electrode material, synthetic resin, glass, etc. |
