| 摘要 |
A method for chemically milling an etchable workpiece by exposure thereof to an etchant in order to mill selected etchant-active areas and thereby form a plurality of raised die elements separated and bounded by a plurality of recessed cavities, which method is comprised of the steps of initially, partially etching the workpiece to form recessed die element precursors separated and bounded by recessed cavities, depositing a film of an etchant-resistant composition on the workpiece in at least selected ones of the recessed cavities, filling those selected cavities with an etchant-resistant filler and then subsequently processing the workpiece. In a highly preferred embodiment, the method comprises depositing a thin film of gold on the workpiece, removing the gold film from selected areas where active etching is to occur, and then filling the recessed cavities with an epoxy filler.
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