发明名称 CONDUCTIVE PASTE
摘要 <p>A novel conductive paste and a method of making the same in which metallic gallium is combined with a metal or alloy which forms a eutectic with gallium in an amount in excess of its limit of solubility in gallium at a specific temperature. This melt is then treated with a metal powder of a second metal or alloy which alloys with gallium to produce a higher melting alloy, the second metal powder being coated on its surface with the eutectic-forming metal.</p>
申请公布号 CA1166873(A) 申请公布日期 1984.05.08
申请号 CA19810392417 申请日期 1981.12.16
申请人 SONY CORPORATION 发明人 OHSAWA, KENJI;ITO, TAKAO;TANNO, KOICHIRO;OHSAWA, MASAYUKI;KURATA, KEIJI
分类号 B22F1/00;B22F1/02;C22C28/00;H01B1/02;H01R4/58;H05K1/09;H05K3/34;H05K3/40;H05K3/46;(IPC1-7):C22C30/00;C22C1/00 主分类号 B22F1/00
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