发明名称 |
CONDUCTIVE PASTE |
摘要 |
<p>A novel conductive paste and a method of making the same in which metallic gallium is combined with a metal or alloy which forms a eutectic with gallium in an amount in excess of its limit of solubility in gallium at a specific temperature. This melt is then treated with a metal powder of a second metal or alloy which alloys with gallium to produce a higher melting alloy, the second metal powder being coated on its surface with the eutectic-forming metal.</p> |
申请公布号 |
CA1166873(A) |
申请公布日期 |
1984.05.08 |
申请号 |
CA19810392417 |
申请日期 |
1981.12.16 |
申请人 |
SONY CORPORATION |
发明人 |
OHSAWA, KENJI;ITO, TAKAO;TANNO, KOICHIRO;OHSAWA, MASAYUKI;KURATA, KEIJI |
分类号 |
B22F1/00;B22F1/02;C22C28/00;H01B1/02;H01R4/58;H05K1/09;H05K3/34;H05K3/40;H05K3/46;(IPC1-7):C22C30/00;C22C1/00 |
主分类号 |
B22F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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