| 摘要 |
PURPOSE:To prevent a peeling on the interface on an adhesive surface between a resin and a tab for a lead frame, and to obviate the generation of a resin crack by executing dimple working to a peripheral section while executing proper dimple working into an internal space for a semiconductor device. CONSTITUTION:The inside of an area 7 in proper size containing the center of a tab 2 forms a space, and a large number of dimples 9 are shaped to the peripheral section 8 of the area 7. The transverse center line 10, longitudinal center line 11 and diagonals 12, 13 of the tab 2 are assumed. An intersection 14 where these lines cross shapes the center of the tab. In the area 7, the dimple 9 is formed at the intersection 14 while a proper number of the dimples 9 are shaped onto the center lines 10, 11 and/or the diagonals 12, 13. Accordingly, the concentration of stress only to each corner section or the concentration of stress only toward the center is prevented, thus balancing stress. |
