发明名称 SEMICONDUCTOR MANUFACTURING EQUIPMENT
摘要 PURPOSE:To improve corrosion resistance by coating respective bonding section partially while also mixing an Al corrosion inhibitor being at issue on insulating performance, such as CaCO3, SiO2, etc. on wire bonding. CONSTITUTION:A thermocompression bonding method is a system in which the tip of an Au wire 4 is heated at a high temperature, and formed to a ball shape, and the ball section 5 is pushed against an Al pad 3 and joined by a capillary 9, but pipes 10 for ejecting flexible adhesives are fixed to the side surface of the capillary 9, and the flexible adhesives 8 are ejected to the periphery of a joining section during a time when the Au wire ball section 5 is pushed. Consequently, only the Al pad being at issue on corrosion and the wire joining section can be coated with the flexible adhesives, thus acquiring the effects of temperature resistance and corrosion resistance without generating the trouble of resin cracks and wire disconnections. An Al corrosion inhibitor, such as CaCO3, SiO2, etc. can also be mixed, thus further improving corrosion resistance.
申请公布号 JPS62115731(A) 申请公布日期 1987.05.27
申请号 JP19850144682 申请日期 1985.07.03
申请人 HITACHI LTD 发明人 HATTORI TOSHIO;SHIMIZU TASUKU;NISHIMURA ASAO;SAKATA SHOJI;HATSUDA TOSHIO
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
主权项
地址