| 摘要 |
PURPOSE:To obtain a chip component with ease of handling and small size by laminating an insulator and a piezoelectric oscillating unit. CONSTITUTION:A quadrangular insulator 11 has notches 13a, 13b, 13c, 13d at its corner. On the wall faces 14a, 14b, 14c, 14d in broadwise direction of the notches and in the vicinity of the notches, conductive films 15a, 15b, 15c, 15d are formed respectively. The size of a piezoelectric oscillating unit 12 is almost the same as the insulator 11. Drawer electrodes 17, 18, 19, 20 are formed at the four corners. The lead electrodes and the conductor films are connected electrically. On the bonding face of the insulator 11 and the piezoelectric oscillating unit 12, a recess 22 is formed, as required, so as not to prevent oscillation. Since chip shape is formed, the manufacture is made easy and the mounting density is improved. |
