发明名称 Multidimensional electric packaging arrangement.
摘要 <p>The invention is a right angle connection utilizing an interposer rod (1) between horizontal (4) and vertical (3) substrates. The interposer rod is of insulating material and has a metal ground plane (7) on its surface, which ground plane is in turn covered by an insulating film (8). Over the insulating film, the interposer has a number of arcuate conductors to which respective conductors (2) of both the horizontal and vertical substrates are connected at controlled collapse pads (5, 6). This provides good electrical and mechanical connection. All circuits are effectively transmission lines because the underlying ground plane is continuous.</p>
申请公布号 EP0106936(A1) 申请公布日期 1984.05.02
申请号 EP19830103811 申请日期 1983.04.20
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 KETCHEN, MARK BENJAMIN
分类号 H01L39/02;H01L39/04;H01R13/658;H01R13/6594;(IPC1-7):01L39/04 主分类号 H01L39/02
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