INTEGRATED CIRCUIT PACKAGE

摘要

An integrated circuit package is provided with a socket arrangement into which a second integrated circuit package may be plugged. In a first embodiment metallization patterns 22 are used to electrically interconnect the first integrated circuit package 10 to a conventional printed wiring board or ceramic wiring board 26 containing socket contacts 28 to receive lead pins from another integrated circuit package. A second embodiment is a unitized package containing integral socket contacts within the unitized integrated package to receive lead pins from another integrated circuit package.