| 摘要 |
PURPOSE:To obtain lead wires each having a thin and uniform solder layer by dipping the lead wires of electronic parts in molten solder through the through holes of a prescribed size in a heat resistant partition plate and by pulling up the wires. CONSTITUTION:A heat-resistant partition plate 10 having through holes 11 is prepared. The inside diameter of the holes 11 is almost equal to the outside diameter of finished lead wires 3 after coating with solder by hot dipping. The lead wires 3 of electronic parts 4 are dipped in molten solder 5' through the holes 11 in the plate 10, and the wires 3 are pulled out of the holes 11. Lead wires 3 each having a formed thin solder layer of a uniform thickness are obtd. |
