| 摘要 |
PURPOSE:To obtain ultra-high frequency apparatus by providing a metal grounding plate which is narrower than the width of lead extending direction at the rear surface of frame of insulator and by loading a semiconductor chip through a metal base on the exposed surface within the frame. CONSTITUTION:The width of metal grounding plate 13 is narrower than that of a ceramic frame 11. A semiconductor chip 17 is combined with the metal grounding plate 13 through a metal base 14. In case of loading a device, grounding can be performed simultaneously with loading by securing the grounding plate 13 to the grounding pattern of the substrate. The edges of the grounding plate 13 and lead 16 ae placed in the same plane and these are soldered to wiring pattern of the printed wiring board 18. According to this structure, static capacitane between the lead 16 and grounding plate 13 is reduced and thereby a device which can be used for ultra-high frequency can be obtained. |
