PROCESS FOR PREPARING A HIGH SPEED ELECTROLESS COPPER BATH

摘要

The bath gives very high rates of copper deposition, typically of the order of 3.2 micron in 20 mins., while maintaining excellent deposit characteristics. This is achieved by a combination of two accelerators, one of which is a polysaccharide. The main application is in metallisation of holes during mfr. of printed circuits, without using an electrolytic flash coating of copper.