| 摘要 |
PURPOSE:To bond a substrate and semiconductor elements with high reliability by utilizing a conductive silver paste where contents of the halogen and alkali metal ion which are extracted with water under the pressure cracker condition or the condition similar to it after they are changed to imides are 100ppm or less. CONSTITUTION:An organic solvent (N-methyl-2-pyrrolidone etc.) and 70-90wt% of solid component of composition of the tree-like or scale-like silver powder of about 325-mesh are kneaded to a precursor of the PIQ resin, etc. obtained by the reaction with a tetracarboxylic-acid-dianhydride or its derivative in combination with a polyamidic acid and its derivative obtained by reaction of diamine (4,4- diaminodiphenilether etc.) and tetracarboxylic-acid-dianhydride (pyromelytic- acid-dianhydride) and diamine and diaminoamido (4,4'-diaminodiphenyl-3-sulfonamide etc.). The delivative is subjected to the refining process and the specified metal ion is set to the specified range. When this paste is used for bonding, excellent heat resistant characteristic, moisture resistant characteristic and conductivity can be obtained. |
