| 摘要 |
<p>1,168,358. Soldering. SIEMENS A.G. 25 Aug., 1967 [3 Dec., 1966], No. 22405/68. Divided out of 1,168,357. Heading B3R. [Also in Division H1] A semi-conductor unit consists of a -semiconductor body containing a PN junction and a pair of electrodes each consisting of a metal layer coated on both-surfaces with lead or a lead-based alloy, the electrodes being soldered by the lead to the semi-conductor, the exposed edges of the semi-conductor body being lacquer-covered, and a pair of terminals being soldered to the electrodes. The invention is a process for producing such a unit in which the terminals are soldered to the electrodes by dipping an assembly comprising the terminals held in contact with the electrodes into a tin-solder bath. The lead on the outer surfaces of the electrodes may but need not be removed, by immersing the lacquered body-plus-electrode structure into a tin bath to dissolve away exposed lead, before the terminal-soldering step. Such removal of lead prevents the subsequent formation of a lead-tin eutectic as the terminalelectrode solder bond, and should therefore be performed if the unit is likely to be used at temperatures above the lead-tin eutectic temperature.</p> |
