发明名称 |
INTEGRATED CIRCUIT CONTACT STRUCTURE |
摘要 |
A multi-layer contact structure is described for providing ohmic contact to a shallow semiconductor region (12) forming a PN junction with a silicon semiconductor body (10). The multi-layer structure includes a layer of polycrystalline silicon (22) doped with an impurity of the same conductivity type as that of the semiconductor region (12). A first layer (26) of a refractory metal is deposited over the polycrystalline silicon layer (22) to provide an electrically stable interface therewith. A second layer (28) of another refractory metal is deposited over the first refractory metal layer and serves to protect the shallow PN junction against current leakage failure. A third layer (34) of interconnect metal such as aluminium is deposited over the refractory metal layer. |
申请公布号 |
JPS5974668(A) |
申请公布日期 |
1984.04.27 |
申请号 |
JP19830171419 |
申请日期 |
1983.09.19 |
申请人 |
INTERN BUSINESS MACHINES CORP |
发明人 |
MOHAMEDO OSAMA ABOORUFUOTOU;YUKU RAN TSUANGU |
分类号 |
H01L29/78;H01L21/28;H01L21/285;H01L21/3205;H01L21/336;H01L23/485;H01L29/43 |
主分类号 |
H01L29/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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