| 摘要 |
Apparatus for soldering on a substrate which is difficult to solder on comprises a vibration tip (12) which is rotatably mounted on an ultrasonic oscillation mechanism (14) and slidable towards and away from a substrate to be soldered. A needle (16) is placed a predetermined distance, in a predetermined direction from the end of said vibration tip and projects to at least the same level as the end of said vibration tip. The needle can be aligned with a mark on the substrate, indicating that the vibration tip is in exactly the right position on the soldering point on the substrate. |
