| 摘要 |
PURPOSE:To perform uniform and sure soldering by submerging a chamber and nozzle part for ejecting solder into the molten solder filled in a solder tank, and ejecting the solder therefrom thereby forming plural projecting waves on the bath surface of the molten solder. CONSTITUTION:A soldering device which fills molten solder in a solder tank 1 provided with a heating element 2, holds a printed wiring board in a carrier 21 moving from the left to the right on a rail 20, subjects the board to flow soldering by the solder ejected from each nozzle 4 submerged into the molten solder, and further subjecting the same to a dipping treatment in a later stage is provided. The solder is forced by a rotary propeller into a chamber 3 from which the solder is supplied to each nozzle part 4 to eject the solder simultaneously from the advancing direction of the above-mentioned board and the direction opposite therefrom, thereby forming plural projecting waves 15 on the bath surface of the molten solder. The uniform and sure soldering with high productivity is thus made possible. |
