| 摘要 |
An apparatus and method for packing a semiconductor device having a strip (20) with a plurality of lead frames (40-49) with a semiconductor device (120) attached to the bar pad (56) of at least some of the lead frames. The strip (20) includes at least one solid thoroughfare (300) on its surface extending to at least two of the lead frames. Plastic in liquid form is supplied through a runner (265, 290) to a mold (190) containing the semiconductor devices (120) and the strip (20). The mold (190) forms a cavity (280) about the semiconductor device (120) and the portion of its associated lead frame adjacent to the semiconductor device (120). In particular the two semiconductor devices (120) attached to the lead frames adjacent the thoroughfare (300) are enclosed in two cavities (280). The plastic is directed over the thoroughfare (300) into the two cavities (280) adjacent to the thoroughfare (300). |
