摘要 |
Chipboard is produced by coating both sides of a phenol resin impregnated chip cake with a phenol resin or urea resin impregnated woold felt sheet, which in turn are covered by thermosetting resin impregnated decorative supporting webs, and forming the laminate to a chipboard panel of 145-165 degrees C and 15 to 25 kp per sq. cm. |