发明名称 |
Adherent metal coatings on rubber-modified epoxy resin surfaces |
摘要 |
A method of forming adherent metallized coatings on a substrate which is useful for the manufacture of printed circuit boards as well as other metal coated articles involves providing the substrate with a rubber-modified epoxy surface or coating, sputter etching at least 50 A. from the surface followed by vacuum depositing an adherent thin metal film of Cr, Ni, Ni-V alloy, Pt, Pd or Ti onto the substrate. Another metal layer is then provided over the adherent thin film.
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申请公布号 |
US4444848(A) |
申请公布日期 |
1984.04.24 |
申请号 |
US19820337054 |
申请日期 |
1982.01.04 |
申请人 |
WESTERN ELECTRIC CO., INC. |
发明人 |
SHANEFIELD, DANIEL J.;VERDI, FRED W. |
分类号 |
C23C14/02;C23C14/20;H05K3/10;H05K3/38;H05K3/40;H05K3/42;(IPC1-7):C23F1/02 |
主分类号 |
C23C14/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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