| 摘要 |
PURPOSE:To improve the reliability and yield rate of a power device, by providing an insulator in the gap between a heat radiating plate and a lead part, thereby preventing the electric short circuit by the lead part. CONSTITUTION:A device is constituted by overlapping a heat radiating plate 3, an insulating film 6, a lead frame 2, and a semiconductor chip 1 at specified positions sequentially from the lower side. Namely, the heat radiating plate 3 is also used as a table for mounting the semiconductor chip 1 for a power IC. A lead frame 2 is provided on the heat radiating plate 3 through the insulating film 6 in an overlapped manner. The lead frame 2 is primarily constituted by the lead parts 4, which are used for the electric connection to the outside. A plurality of the lead parts 4 are provided at the outside part of the chip 1 in a radial shape, and electrically connected to the chip 1 by bonding wires 5. The heat radiating plate 3 is of a rectangular shape. The central parts of the two short sides have an H-shape obtained by forming a semicircular shape. The parts are provided for radiating the heat generated in the semiconductor chip 1 for the power IC and cooling the device. |
