| 摘要 |
A one-piece snap-in spacing device and support member for circuit boards is provided with a tapered pin axially disposed at each end of a spacer body to fit snugly into corresponding holes positioned near the edges of a pair of circuit boards. Integrally molded with the spacer body is a pair of clips each having a ramped nib to engage and grip the edge of a circuit board with a snapping action. The spacing device is provided with a flat surface for mounting to a chassis.
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