| 摘要 |
PURPOSE:To attain flatness without generating a gap between a coil and a recessed inner wall, by forming a recessed part on an insulating layer, a conductor layer at the bottom only of the recess and the coil in the recess by the plating method. CONSTITUTION:A polyimide system resin PIQ layer 32 (4mm. film thickness) is formed on a substrate 31, an Mo layer 33 (0.3mum) is deposited thereon and patterned by the photo etching method. A PIQ layer 32 is processed for the oxygen sputter etching by using the Mo layer 33 as a mask. Then, a Pt 34 (0.3mum) is vapor-deposited vertically to the substrate 31. A voltage is applied to a Pt layer 34 in 1% sulfamine acid water solution and only the Mo layer 33 is removed by electrolytic etching. Then, the coil 35 is formed in the recess by the electrolytic plating method by using the Pt layer 34' as the electrode. A PIQ layer 32' is coated on the upper surface to make the upper surface flat. Thus, the flat processing is attained easily because no gap is produced between the coil 35 and the inner wall of the recess. |
