| 摘要 |
PURPOSE:To enhance processing capacity of a semiconductor device manufacturing device by a method wherein a third containment part to contain semiconductor substrates impossible to be positioned automatically is provided, the semiconductor substrates impossible to be positioned automatically are transmitted automatically thereto, and are enabled to be processed artificially in a lump finally. CONSTITUTION:The semiconductor substrate adhered with a photo resist is transported to a positioning part 2 from a first containment part 1 on the supply side, and is exposed after it is positioned automatically. The exposed semiconductor substrate is contained in a second containment part 3 on the containment side. At this time, when the semiconductor substrate impossible to be positioned automatically appears, the semiconductor substrate is carried out to a third containment part 4 for exclusive use of the substrates impossible to be positioned automatically. The substrates impossible to be positioned automatically are collected in the third containment part to be positioned artificially in a lump, and this device exhibits the effect for reduction of labor and enhancement of processing capacity. |
