| 摘要 |
PURPOSE:To obtain a device, which can reduce costs, by bonding and fixing external taking out electrodes, extracting electrodes, and bonding parts respectively of a photoelectric conversion element and a substrate, thereby simplifying the taking out of the electrode to the outside, improving environment resisting property, and implementing miniaturization and mass productivity. CONSTITUTION:An alumina substrate 1, on which solder layers 8 are formed, is placed on a hot plate, and the solder layers 8 are fused. A sapphire plate 100, on which solder layers 106 are formed, is mounted on the alumina substrate 1. A first bonding part 5 and a second bonding part 104 are bonded in an airtight manner with the solder layers 8 and 106 as a bonding agent, and a partitioning wall is formed. An electrode part 6 is connected to a conductor layer 3 in order to obtain the electrical connection to a photodiode 102. The electrode part 6 and an external taking out electrode 105 are connected by the solder layers 8 and 106. Then, a lead pin 201 is connected to an external taking out terminal 7. The lead pins 201 have the approximately same length so that they can be electrically connected to both surfaces of the alumina substrate 1 and the like. In this way, wire bonding of Al or Au wire is not needed for taking out the electrode to the outside. Wiring to the alumina substrate and the like can be performed by the means of thick film printing or thin film evaporation. |
