| 摘要 |
<p>PURPOSE:To shorten washing time, and to keep consistency in a process by mechanically expanding the cutting surface arbitrarily and washing it. CONSTITUTION:Kerfs 5 are formed to wafers 3 pasted on an adhesive sheet 2 by a dicing saw, but the wafers on the adhesive sheet 2 are set up on a semicylindrical plate, and the sheet is fixed. Accordingly, the wafers are washed by flowing water or an ultrasonic washer under the state and the cutting surfaces are washed because the kerfs are widened.</p> |
