发明名称
摘要 A chip capacitor 10 is shaped so that when placed on a circuit board 11 the terminals 17 are spaced from the circuit board. The terminals and conductive lands 18 are connected by columns of solder 16 which form a compliant bond resistant to mechanical and thermal shocks. <IMAGE>
申请公布号 FR2441912(B1) 申请公布日期 1984.04.20
申请号 FR19790028339 申请日期 1979.11.16
申请人 AVX CORP 发明人
分类号 H01G4/12;H01G2/06;H01G4/232;H01G4/30;H01G13/00;H05K3/34 主分类号 H01G4/12
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