发明名称 METHOD AND APPARATUS FOR WIRE BONDING
摘要 PURPOSE:To bond a wire accurately to the center of an electrode by obtaining the center of an indentation of a capillary by processing the picture signal of the indentation of the capillary, acquiring a distance with an optoelectric transducer, calculating the coordinates of bonding and automatically resetting the quantity of offset. CONSTITUTION:An excessive wire 10b is stretched to a lead frame before the wire is bonded to a first pellet 11, the picture of the indentation 10c of the capillary 6 is taken in by an ITV camera 9, and processed by a capillary-indentation center detecting circuit 17, and the quantity of displacement from the reference position of the indentation is calculated. A distance between the center of the ITV camera 9 and the center of the capillary 6. The quantity of offset, is reset on the basis of the quantity of displacement, and pellets 11... are bonded accurately in succession. Even when a tool arm 7 and a camera holder 8 are thermally deformed and the ITV camera 9 and the capillary 6 are exchanged, the quantity of offset can be set accurately and automatically, and the wire can be bonded to the center of the electrode.
申请公布号 JPS5969939(A) 申请公布日期 1984.04.20
申请号 JP19820180908 申请日期 1982.10.15
申请人 TOSHIBA KK 发明人 KASHIHARA TOMIO
分类号 H01L21/60 主分类号 H01L21/60
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