| 摘要 |
PURPOSE:To ensurely separate high quality semiconductor product from frame by providing a frame removing mechanism which securely separate punched semiconductor products from punching refuses. CONSTITUTION:A punching refuse removing apparatus 50 is formed by disposing a frame placing board 38 and a semiconductor product accommodating board 39 is both sides of a punching part 30. A frame 33 securing many semiconductor products 34 is placed on the placing board 38 and the frame 33 is sent to the punching part 30 using a transfer arm 40. Products 34 are separated from the frame 33 by means of a punch 35 provided at the punching part 30 and the punching refuses generated are caused to drop into the space within the frame placing board 32 forming the punching part 30. Thereafter, the separated products 34 are dropped into a product container 39 by the product transfer arm 42 having the chuck at the lower side and only the products 34 having no punching refuses are accommodated in the container 39. |
