| 摘要 |
The package (21) has ceramic substrate layers 22, 22 min , 22 sec , 22'''. Terminal steps 19 for connection to a mother board (40) are provided in a lattice array over the bottom surface of bottom layer 22'''. The terminal steps 19 are connected to internal bonding pads 26 to which contacts of a semiconductor device are connected by way of wiring 27, 32, 33 on surfaces of the layers 22 min , 22 sec , 23''' and by way of through holes 24 in the layers. |
